Analysis

Stress, thermal, vibration and shock behaviour is established before a part is selected and before it reaches the chamber: static and dynamic analysis first, then multi-body dynamics and hardware-in-the-loop, so the qualification test confirms a prediction instead of discovering a failure.

  • Static analysis, linear and non-linear
  • Modal extraction and harmonic response
  • Random vibration, drop and shock
  • Multi-body dynamics (MBD)
  • Hardware-in-the-loop (HIL)
  • Rapid virtual prototyping
  • Control algorithm verification on the microprocessor
A ballscrew linear stage with its stepper motor on an optical table, the end block carrying a coloured stress map from a structural analysis.

Where this work happens

R&D Centre

Melih Gökçek Bulvarı, Teknopark No: 61/19, 06378 İvedik OSB, Yenimahalle / Ankara

Mechanical, electromechanical and electronic design, structural and thermal analysis, multi-body dynamics, hardware-in-the-loop simulation and embedded software. Design decisions are taken and verified here before anything is cut.

Two newly powered HIL racks with neatly routed cable trays, squared documentation folders and a panel still under protective film.